Flexible Electronics News

Applied Materials Solves Critical Interconnect Challenge with Breakthrough Flowable Copper Technology

Revolutionary method of depositing the vital wiring seed layer has no foreseeable node limit

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By: DAVID SAVASTANO

Editor, Ink World Magazine

Applied Materials, Inc. pushed the boundaries of interconnect technology, the pathways that connect the billions of transistors on a chip, with the announcement of its Applied Endura Amber PVD system. Featuring revolutionary copper reflow technology, the Amber system is the only single-chamber solution proven to enable void-free copper structures at the 1Xnm node – a critical challenge in the manufacturing of advanced logic and memory devices. “The Applied Endura Amber system deli...

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